Welcome to TPACK >> Resources >> TPACK Newsletters >> Issue 3 November 2008

Issue 3 November 2008

Re-thinking System Design

In this time of financial turbulence, many of us are re-thinking our plans and strategies. Achieving greater cost optimization is key, but it cannot be at the expense of performance, as the Internet continues to grow between 50% and 80% a year.

In "Rationalizing system design using Universal Linecards", TPACK provides a solution to this conundrum with a business case showing from 20% to 40% cost reductions AND the ability to competitively differentiate system products. Read this and other news on customer wins, webinars, articles, presentations and more below...

Contents:

Rationalize system design with Universal Linecards

Imagine a system with linecards based on a single hardware design, but where the functionality delivered by each card can be completely different. Imagine being able to deliver exactly the feature set required by each carrier; no more and no less. Imagine being able to change and update this functionality as market demands change.

Imagine no longer! With Universal Linecards, this is now possible. A Universal Linecard is a multi-function linecard based on a single hardware design and layout, but where the interfaces and functionality provided by the card can be programmed on deployment.

By using pluggable optics and TPACK chip solutions based on programmable FPGAs, it is now possible for system designers to support many feature set variations and accommodate customer specific requests quickly, efficiently and cost-effectively. Not only that, but Universal Linecards mean lower risk as bugs in functionality can be quickly repaired, sometimes even before customers realize there is a problem.

In "Rationalize system design with Universal Linecards", TPACK outlines the benefits of basing system design on a Universal Linecard approach along with a business case showing from 20% to 40% savings. Download this paper here:

For more info on Universal Linecards see here.

Fujitsu chooses TPACK SOFTSILICON for FLASHWAVE®

Fujitsu Limited, Japan has signed a long term agreement with TPACK for supply of an advanced SoftSilicon Ethernet over NG-PDH product targeting the Fujitsu award winning FLASHWAVE® series platform.

”Fujitsu has selected TPACK due to their ability to provide a standard SoftSilicon product that met our demanding requirements and our short time to market objectives”, stated Mr. Minoru Takeno, Senior Vice President, Photonics Systems Group, Fujitsu.

”We are excited and honored to be selected by Fujitsu for this project. It is a perfect example of how TPACK’s unique SoftSilicon concept can help our customers to introduce new functionality quickly and efficiently.” stated Peter Viereck, CEO TPACK.

Fujitsu is one of the leading providers of optical transport equipment in North America where the FLASHWAVE series is extensively deployed. TPACK’s solution will allow the FLASHWAVE series to support provisioning of Ethernet Services over existing DS-1 and DS-3 connections making it ideal for mobile backhaul, central office hand-off and business connectivity applications.

Scale packet transport networks to 40 Gbps

See the joint TPACK and Altera webinar "Scale packet transport networks to 40 Gbps using FPGAs" where you will learn about flexible standard products which target packet transport applications, built with Altera® FPGAs and TPACK's Carrier Ethernet technology. You'll see how new 40-nm FPGAs enable Carrier Ethernet solutions at 40 Gbps, and about a new universal line card.

View now

Making a packet

We would like to draw your attention to a new article in New Electronics Magazine featuring TPACK. In "Making a Packet", Roy Rubenstein takes a look at chip solutions for Packet Optical Transport Networks with a special focus on TPACK's TPOX3203 Packet Optical Engine. See the article here:

http://www.newelectronics.co.uk/article/15410/Making-a-packet.aspx

For more info on the TPOX3203 see here:

TPOX3203 Packet Optical Engine

A brief history of Connection Oriented Ethernet

See the presentation "A brief history of Connection Oriented Ethernet"
made by TPACK’s Director Marketing, Daniel Joseph Barry at the Lightreading Ethernet Expo. The presentation was made as part of the panel discussion on “Connection-Oriented Ethernet: From Curiosity to Deployment ” on Monday 20th at 2 pm together with Ciena, Fujitsu and Nokia Siemens Networks. The Lightreading Ethernet Expo event was held at the Hilton New York from the 20th to the 22nd of October and attracted 631 delegates (non-sponsors) and 50 exhibitors.

For more information see: http://www.ethernetexpo.com

TPACK appoints new chairman

TPACK has appointed Hassan Parsa as its new chairman of the board. Mr. Parsa has been a member of the TPACK board for over a year and brings several years of experience in the semiconductor and telecom industry to the position.

Hassan Parsa has served as Vice President of Business Development for Centillium since 2003. Prior to joining Centillium, Mr. Parsa has held several positions with Lucent Technologies and AT&T Bell Laboratories, including a role as the founding partner of Lucent Venture Partners.

“I am honored to accept the position as chairman of the board at TPACK. Having spent the last year working closely with TPACK management, I have gained an appreciation of the results that have been achieved and the tremendous potential that TPACK presents. With its unique concept of SOFTSILICON flexible standard chips, TPACK is establishing a new trend in chip development that is resonating with many across the Telecom industry. This is just the beginning”, said Mr. Parsa.

“We are very fortunate to have someone of Mr. Parsa’s experience in the role of Chairman. He understands the opportunities and challenges that we face in this industry and can help us to take advantage of the strong position that we have established over the last few years. We are looking forward to a long and productive relationship with Mr. Parsa”, said Peter Viereck, CEO TPACK.