Issue 3 October 2009
Happy Halloween from TPACK!
The 4th quarter came faster than expected and along with it the fall, which holds a couple of very important tradeshows for us. In September, we had an exhibit at the Carrier Ethernet World Congress in Berlin, where we had a good show. Now we are busy gearing up for our last big event of the year, SUPERCOMM.
In about two weeks time we will be ready to welcome visitors at our booth at the McCormick Place in Chicago. Find more details about the event and how to register below. We hope to see many of you there.
TPACK recently released a new white paper together with Altera, covering our TPO124 OTN Mapper. We also got good media coverage in the past quarters where we had an article in both Lightwave and FibreSystems Europe. In addition, EnGenius gave us a good product review and a low salt-shaker rating.
I hope you enjoy it all.
Happy Holloween,
Thomas Rasmussen
VP PLM, TPACK 
C
ontents:
- TPACK participated in Light Reading's
Packet Optical Virtual Tradshow - SUPERCOMM returns and TPACK will be there
- New white paper on TPO124 available
- Media articles with coverage of TPACK
Packet-Optical Transport Virtual Tradeshow
TPACK sponsored Light Reading's second ever virtual tradshow this summer. The event had 8 exhibitors and was the industry’s largest optical networking virtual tradeshow to date! 1,757 participants registered for the Optical Virtual Tradeshow and 881 attendees participated in the virtual tradeshow from more than 49 different countries.
Lars A. Pedersen, CTO at TPACK, participated in the Understanding the Role of Connection-Oriented Ethernet in Packet-Optical Transport Webinar together with Gridpoint Systems. To check out this webcast, please click here: Connection-Oriented Ethernet Webinar.
It is still possible to access the archived show, which includes all panel sessions and sponsor booths, and it will remain available for viewing on the Light Reading site until Wednesday, October 14, 2009. Please click here to be taken to the show login page: The Packet Optical Transport Evolution Virtual Tradeshow Archived Event.
SUPERCOMM 2009
TPACK exhibiting at SUPERCOMM in Chicago in October
Come meet TPACK at the McCormick Place from Wednesday, October 21 to Friday, October 23, 2009. We are located at booth number 5018 and welcome you to come and have a non-committal talk with our qualified booth staff.
SUPERCOMM is where the vision of broadband comes to life
SUPERCOMM is the only industry event that showcases the entire spectrum of broadband technologies. It's the premiere forum for thousands of network technology buyers from large and small service providers as well as from private enterprises and institutions to source new products, network with peers, and gain critical insights into maximizing and monetizing their network investments. Register today and stop by our booth. We look forward to seeing you at the show.
New white paper on TPO124 available
TPACK's OTN Mapper, TPO124, is based on a low-cost 40-nm FPGA from Altera, which has enabled TPACK to develop and deliver an OTN mapper chip solution that can compete with a standard cell ASIC-based solution on cost, power, and features.
The TPO124 is based around the targeted feature set required to build an OTU1/OTU2 muxponder, and the TPO124 is designed to be the lowest cost and power solution for this application. If additional features are required (such as a packetized interface or a special enhanced FEC), the TPO124 can be adapted to include these new features. TPACK has many years of experience in making such customer-specific adaptations, with a typical turn-around time of three to six months. In contrast to the TPO124, the standard cell-based ASSP solution is a superset of features that may or may not be required for a given application.
Most ASSP's developed today are in the best case based on 65-nm ASIC technology. Any changes, such as if a standard is changed or if a customer requests a specific feature, require a costly respin of the ASIC, which may take 9 to 12 months to complete. The flexibility and advanced feature set in the TPACK TPO124 is due in large part to TPACK’s SOFTSILICON approach to implementing its device solutions, which is a complete standard-featured turnkey image for download in an Arria II GX FPGA.
Get a full copy of the white paper here:
"Leveraging Cost-Optimized FPGAs to Deliver OTN Mapper Solutions"
For more information on TPACK's TPO124, see http://www.tpack.com/solutions-and-products/smartpack-products/p-ocket-otn-mappers/tpo124.html
TPACK has contributed to several articles in 2009
TPACK and Altera co-authored an article on Power-Optimization
"Power-Optimizing Your Telecom Applications" from the online September edition of Wireless Design & Development Asia by Kevin Cackovic, Altera Corp., and Thomas Rasmussen, TPACK, talks about how the SOFTSILICON model from TPACK continues to meet demands for higher bandwidth capacity and more intelligent processing, while using Altera's FPGA's that provide lower power consumption. You can find the entire article here:
http://www.wirelessdesignasia.com/article-11267-poweroptimizingyourtelecomapplications-Asia.html
Thomas Rasmussen, VP PLM TPACK, wrote two articles for FibreSystem Europe og Lightwave.
In "What features should packet optical transport equipment contain?" by Thomas P. Rasmussen, VP of Product Line Management, TPACK, an overview of the approach for meeting architectural requirements with packet optical transport networks is provided. The article describes the key elements of a P-OTN platform and why such systems have a good chance of becoming the preferred approach. The article is available in the May 2009 edition of Lightwave Magazine and can be downloaded as a PDF from the following address:
http://online.qmags.com/LW0509/Default.aspx?fs=2&pg=38&mode=2/
In "Technology tutorial: OTN in metro networks", Thomas P. Rasmussen explains the benefits of efficient Gigabit Ethernet connectivity in next-generation optical transport networks using ODU0. The article is a web exclusive article in the May/June edition of FibreSystems Europe magazine and is available online at:
http://fibresystems.org/cws/article/magazine/39336
TPACK's P-OCKET family featured as Product of the Week June 1st 2009 by EN Genius Network. Product review by Lee Goldberg with "shaker rating" of 1.5.
http://www.en-genius.net/site/zones/networkZONE/product_reviews/netp_060109
