Issue 1 February 2010
The World goes ODU0 with TPACK!
Last year, TPACK introduced our first
P-OCKET OTN mapper products which included support for the new ODU0 standard from ITU-T providing a simple and efficient GE over OTN switching capability. During the second half of 2009, we have seen that carriers have started to demand that ODU0 is supported in new equipment and in return, equipment vendors are busy adding ODU0 to their existing or new P-OTS platforms.
Thus, TPACK has had an overwhelming interest in our standard SOFTSILICON product – the TPO124 – that delivers ODU0 at a cost, power and feature efficient manner. With many TPO124 design wins closed in Q4-2009 and Q1-2010, we foresee a very bright and busy 2010 for TPACK.
In this newsletter, you can read about a new product in the P-OCKET OTN mapper family, the TPO114, which is a complete 2.5G (OTU1) OTN Add/Drop Multiplexer in a single chip. Also, with ODUflex now being standardized by ITU-T as the way to enable flexible bandwidth tunnels across an OTN network, TPACK shows one of the strengths of the SOFTSILICON model by introducing this new feature just a few months after the standardization is done. If you want to learn more about the new possibilities you get with ODU0 and ODUflex, we recommend you read our latest white paper on this subject.
In 2010, we have been invited to speak at two important conferences, among others. First, OFC in San Diego from the 22nd to the 25th of March and secondly, Packet Transport Networks in Milan, were TPACK will be leading a workshop with Adva, Alcatel-Lucent and Nortel. Read more about both events below, and about Integrity PR, a new Public Relations agency we have brought onboard in order to help us reach out to all the relevant colleagues in the industry.
Contents:
- New product release: TPO114 Add Drop MUX with ODU0
- P-OCKET family upgraded to support the newly standardized ODUflex
- New white paper: ODU0 and ODUflex - A Future-Proof Solution for OTN Client Mapping
- Hear TPACK speak at OFC and stop by our booth
- TPACK hosting workshop with Alcatel-Lucent, Adva, and Nortel during Packet Transport Networks in Milan
- Presenting TPACK's new PR agent
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TPO114 Add Drop MUX
In January, TPACK announced the TPO114 OTN Add-Drop MUX, the newest member of the P-OCKET family of OTN Mappers.
The key features of the TPO114 are:
• 2.5 Gbps bandwith
• G.709 OTN mapping and framing
• Efficient any rate to OTN mapping including standards compliant GE to ODU0
• Highly flexible, any rate, and any protocal client ports
• Built-in ODU ADM for efficient sub-wavelength networking
• Standard FEC
• Low power 40 nm silicon technology
The TPO114 is a cost efficient, 2.5 Gigabit per second OTN add-drop multiplexer on a single chip. Like the rest of TPACK’s P-OCKET devices, the TPO114 supports both ODU0 and ODU1 connectivity through an advanced built-in lower ODU cross connect.
For complete information on the TPACK TPO114 visit: http://www.tpack.com/products/p-ocket-otn-mappers/tpo114.html
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Addition of ODUflex to P-OCKET
TPACK has made a timely strategic move to upgrade the P-OCKET family to support the newly standardized ODUflex.
With support for ODUflex, TPACK’s P-OCKET devices now allow for bundling of several ODU0 channels to form right-sized transport tunnels with greater bandwidth granularity than previously supported by the OTN standard. For example, four ODU0 channels may be grouped into one tunnel that can transport a four Gigabit per second Fibre Channel over OTN.
“Adding ODUflex to the P-OCKET product family as a standard feature just a few months after the ratification in ITU-T of this new standard clearly demonstrates the time-to-market advantage our customers gain by using the TPACK SOFTSILICON approach,” said Thomas Rasmussen, VP of Product Line Management at TPACK.
To see the full press release, click here
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New white paper: ODU0 and ODUflex - A Future-Proof Solution for OTN Client Mapping
To address the growing number of new client signals, ITU-T added two new lower order ODU containers to the OTN hierarchy. ODU0 is optimized for GE clients, while ODUflex provides a future-proof solution for any client with a rate above ODU1. This paper discusses the introduction of these lower order ODU0 and ODUflex containers and how they fit into the OTN hierarchy.
The white paper can be downloaded here
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TPACK invited to speak at OFC in San Diego in March
Register today and come to OFC and hear TPACK speak on one of the Market Watch panel discussions. TPACK's VP PLM, Thomas Rasmussen, will be one of five speakers on Panel IV called Packet Optical Migration - The Case for Multilayer Transport Equipment, with Andrew Schmitt, Directing Analyst, Optical, Infonetics Research, USA, as moderator.
This panel features discussion of the costs and benefits of converged packet optical transport, where optical equipment integrates optical, circuit, and packet transport and switching capabilities. The panelists will look at the advances in component technology that make these systems possible as well as understand the advantages and drawbacks to deploying them in carrier networks.
Thomas will give an exclusive insider look at one of todays most important industry development.
Carriers are faced with the delicate issue of massively expanding the transport capacity in their networks while at the same time lowering the cost per bit. This presentation will highlight two potential strategies for solving this dilemma and show what the actual network equipment could look like. In both cases the traditional SONET/SDH is removed as transport layer and the typical CWDM is replaced by DWDM. The first option is to replace the SONET/SDH layer by electrical sub-wavelength tunnels (typically ODU0-tunnels) over OTN. This solution is simple to operate, but it has a relatively coarse granularity and does not allow differentiation among user traffic. The other option is to use MPLS/MPLS-TP tunnels (Label Switched Paths) over 10 Gigabit Ethernet over OTN. This solution is somewhat more complicated to manage, but it does allow for traffic management down to individual customer flow level.
The panel is scheduled for Thursday, March 25, at 10:00 - 12:00 and is held in the Exhibit Hall Theater. Market Watch presentations are fee to all attendees. For more information about the Market Watch, click here
http://www.ofcnfoec.org/Dates: March 23-25, 2010
Venue: San Diego Convention Center,
California, USA.
TPACK Booth: # 3230
To get your free Exhibits Pass Plus, courtesy of TPACK, click here
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TPACK is hosting workshop with ALU, ADVA and Nortel
Again this year, TPACK is participating in IIR's Packet Transport Networks, which takes place in Milan from April 19th to 21st., and we are honored to be hosting a pre-conference workshop with guest speakers from Alcatel-Lucent, ADVA and Nortel.
The workshop is called P-OTN NETWORK ARCHITECTURE TRENDS, takes place on Monday, April 19, from 9 a.m. to 12.30 p.m. and the agenda is a follows:
What is P-OTN and OTN networking?
Thomas Rasmussen, VP, PLM, TPACK
- Latest amendments to G.709 standard
- Status on MPLS-TP/PBB-TE
- Drawbacks and benefi ts of P-OTN versus OTN level only networking
OTN networking in Next Generation Transport Networks
Michael Adams, Strategy & Architecture Leader, NORTEL
- Drivers and applications for OTN networking
- Combining OTN with photonic layer agility
- Optimising backbone networks with OTN-Lambda
MPLS-TP in P-OTN Networks
Italo Busi, CTO Group, Optical Division, ALCATEL-LUCENT
- Description of T-MPLS/MPLS-TP
- How does MPLS-TP work together with OTN?
Dynamic optical networking using OADMs and OTH cross connects
Stephan Neidlinger, VP Applications and Solutions Management, ADVA OPTICAL NETWORKING
- Dynamic optical networking on lambda and OTN level
- Applications and architecture of lambda based networking (FOADM/ROAM)
- Applications and architecture of OTN based networking (OTN cross connectson ODUK-level)
For more information on the conference, click here
TPACK brings new PR Agent on board for 2010
TPACK is starting out the year by partnering up with Integrity Public Relations (IPR) as our new media relations representative. We are enthused to have the opportunity to work with IPR and look forward to continuously raising the awareness of TPACK around the world!
Some of you might already have been in contact with Ken Hagihara, as he joined us at SUPERCOMM in Chicago last October, and he also has spend part of January reaching out to both media people and analysts within TPACK's technical sphere to introduce himself.
If you have any PR related questions or issues, please contact Ken directly.
Ken Hagihara
Media Relations Representative
Tel: +1 949-768-4423 ext. 801
Email: ken@integritypr.net
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