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Issue 2 June 2009

Onwards and Upwards

As the new CEO of TPACK, I am pleased to present to you this quarterly newsletter focused on next generation OTN. It is a privilege to manage a company well known for supplying the world’s largest transport equipment vendors with high quality products. Furthermore, TPACK’s extensive domain knowledge enables us to provide our customers with comprehensive technical support during their entire product life cycle.

In this news brief you will find a background white paper and articles on next generation OTN written by our VP of PLM, Thomas Rasmussen. Also, you can read about TPACK’s new family of next-gen OTN devices –
the P-OCKET OTN mapper products.

At TPACK we are dedicated to contribute to making telecom equipment greener, and to support this we invest in migrating our older products into low power 65nm and 40nm silicon technologies, as you can read about in the joint white paper with Altera.

I look forward to working with you and learning about your leading products in the near future.

Best regards,

Colin Mcnab,
TPACK

Contents:

New CEO at TPACK

TPACK's Board of Directors have named Colin L.M. Macnab Chief Executive Officer. Colin replaces Peter Viereck, who has now left the company.

"Peter has done a great job in building a world class team that has delivered outstanding products and advanced the company to its current stage. With Colin's depth of sales and marketing expertise and experience in growing successful businesses, I am convinced that TPACK will grow to become a market leader in its segment," said Hassan Parsa, Chairman of the board.

Colin was most recently CEO of ultrawideband chip pioneer Artimi (Cambridge, England) and has over 25 years of semiconductor industry experience in startups and large companies, including senior management roles at Atheros and Morphics Technology, which he founded and was subsequently sold to Infineon Technologies.

TPACK focuses on Ethernet solutions for telecom transport technology. "I was most impressed with the technology and support that TPACK has delivered to many Tier 1 telecommunications equipment companies, and their enthusiastic approval of the results," said Colin. "With the strong product portfolio and a new range of OTN products that TPACK will deliver this year, I am very pleased to join the company and lead the next stage of its growth to become a major technology provider to this industry."

To see the full press release, click here

"Packet-OTN - The Transformation Continues"

This white paper addresses the evolution of the “P-OTN” or Packet Optical Transport Network market. That is to say, packet transport networks built upon the ITU-T’s established set of OTN network standards such as Recommendation G.709. P-OTNs can be built using multiple optical, Ethernet and/or MPLS network elements, including fully converged elements which Verizon, for example, has termed “P-OTP” or Packet Optical Transport Platform.

Increasing packet traffic demands a further increase in Carrier Ethernet capacity and efficiency. A tighter integration of packets with the optical network is required, together with more intelligent and dynamic control and this is driving the development of P-OTN and the corresponding platforms with which to build them.

The next phase in P-OTN evolution is the development of MPLS-TP technology, which promises to reduce capacity costs and packet network complexity, while improving scalability and flexibility – and maintaining compatibility with the installed IP/MPLS router network. Carriers have never had more choice in technology integration options – and as the optimal solutions become evident, this dynamic market is set for further evolution.

To get your copy of the white paper, follow this link:
Packet-OTN The Transformation Continues

Arria II GX White Paper

The combination of Altera’s Arria II GX family
and TPACK’s 2.5-Gbps/10-Gbps Ethernet-over-SONET/SDH and 10-Gbps/20-Gbps switch/NPU solutions meet the requirements of next-generation MSPP linecards and maintain existing infrastructure.

Traditionally, the development of application-specific chip products such as ASSPs is based on foundry manufacturing, either in-house or via commercial foundries. FPGAs also are based on this manufacturing process, but due to their broader and more generic application, the production volume that FPGAs attain justifies investment in the latest manufacturing processes and technology. In turn, this benefits the designer with lower power consumption and greater integration resulting in a lower cost per logic unit.

This white paper shows how TPACK uses Altera’s Arria® II GX FPGAs to offer new SOFTSILICON products for carrier-Ethernet-transport and packet-transport applications. Designed for cost-sensitive applications, Arria II GX FPGAs are the lowest power FPGAs with up to 3.75-Gbps transceivers. This allows TPACK to deliver solutions superior to traditional ASSP products in terms of power, cost, and features.

To get your copy of the white paper, follow this link:
Enabling Ethernet-Over-NG-SONET/SDH Solutions for MSPP Linecards

TPACK Leads the P-OTN Transition

AT TPACK we are focused on the P-OTN transition, and in this context we recently launched P-OCKET, a complete family of OTN devices. The OTN Mappers enable the lowest possible software development costs for our customers by re-using software across the complete range of bandwidths.

The P-OCKET devices are suited for both new OTN cross connect systems as well as traditional Muxponder-based systems, and will support line rates from 2.5G (OTU1) to 100G (OTU4). P-OCKET supports efficient and transparent mapping of any client (packet or TDM) into OTN including GE into ODU0 and STM-1/4, OC-3/12 into subrate ODU1 containers.

All P-OCKET devices are based on TPACK’s SOFTSILICON concept offering fast time to market, flexibility in design options, and commitment for supply. P-OCKET includes the only standard product for OTU1 on the market, and is likewise the first products on the market to support GE and sub 2.5G client mapping into OTN as well as OTN cross connect architectures at all line rates. Additionally, TPACK is the only vendor to offer a complete set of OTN products that covers all line and client rates.

“I am especially excited by our new P-OCKET family of OTN devices because carrier feedback points to a strong need for a new type of OTN based cross connect equipment that requires the functionality P-OCKET provides”, said Lars Pedersen, CTO TPACK.

For complete information on the TPACK P-OCKET family visit: P-OCKET OTN Mappers

In continuation, the Technology Marketing Corporation (TMC) has just named the TPOX3203 Packet Optical Engine as a recipient of a 2008 Communications Solutions Product of the Year Award.

TPACK’s TPOX3203 Packet Optical Engine provides a unique
solution combining Carrier Ethernet switching and OTN support
in a single device. With both standard and enhanced Forward Error Correction (FEC), the solution is ideal for Packet Optical Transport Network (P-OTN) applications. TPOX3203 is based on a combination of TPACK’s TPX3103 PBB-TE/T-MPLS/VPLS Carrier Packet Engine, and a 10 Gbps Ethernet over OTN Packet Mapper. This provides an integrated solution with low power and space requirements.

“We are honored to receive this award in recognition of a unique and groundbreaking product” said Thomas P. Rasmussen, VP PLM TPACK. “We intend to continue developing new leading edge products to meet our customers’ need for building OTN networking equipment that eliminates the need for SONET/SDH as intermediate transport layer”.

For complete information on the TPOX3203 click here