Issue 2 July 2010
Sizzling Summer News from TPACK
In this newsletter, you can read about the lastest award that TPACK has received. One of the SOFTSILICON products in TPACK's TPO series of OTN devices, the TPO124 OTN Mapper, has recently been rewarded with the Communications Solutions Product of the Year 2009 Award. TPACK is excited to receive this award in recognition of a unique, design winning solution. The TPO series now also includes two new ODU Multiplexers made for large Terabit per second OTN Cross Connect systems, the first standard IC products on the market.
The spring has been busy for TPACK and we have received a third round of funding from our investors to secure our growth and expand our OTN SOFTSILICON product offerings. TPACK also partnered with Cypress and were first on the market with our Springbank reference design for Ethernet Switches and Traffic Managers. Last but not least, you will currently find a highly relevant article in EE-Times explaining the great advantages of TPACK's SOFTSILICON model and how it is a both a highly flexible and a low-cost solution compared to ASSPs.
On the trade show scene, TPACK just participated in the postponed IIR conference, Packet Transport Networks, which got moved from April to July due to the volcanic eruption in Iceland this spring. TPACK was a sponsor of the conference and contributed with both a workshop and a keynote session. Smilarly in the fall, we are sponsoring IIR's Carrier Ethernet World Congress, where we will talk about our 100 Gbps Switch solution among other things. We hope to see you there.
TPACK wishes everyone a wonderful summer!
Contents:
- TPACK's TPO124 awarded Product of the Year
- Thank you for visiting us at PTN in Milan
- TPACK's TPOC244 and TPOC314 are winning design wins
- See TPACK contributed article in EE-Times
TPACK receives 2009 Product of the Year Award from Communications Solutions
For the third year in a row, TPACK is rewarded with Technology Marketing Corporation's (TMC) Communications Solutions Product of the Year Award. TPACK's TPO124 OTN Mapper was honored for outstanding innovation.
“We're very excited about this award as it truly validates the TPO124 as one of the most innovative solutions in data communications technology. The TPO124 and our other cost-effective SOFTSILICON products have been incorporated into solutions that have won multiple design wins and even displaced ASSP solutions at large Tier 1 providers" said John Jorgensen, VP Sales and Business Development TPACK.
TPACK’s TPO124 OTN Mapper is designed to address the stringent performance and reliability requirements of next generation Optical Transport applications such as MSPPs, MetroWDM, P-OTN, and Carrier Ethernet Transport. The TPO124 OTN Mapper enables early market introduction of products that deliver new OTN mapping and networking features at a competitive cost. For instance, TPACK’s OTN Mappers are the only products in the market that support ODU0 and ODUflex mapping, protection and cross connection capabilities.
The 2009 Product of the Year Award winners can be found on the Communications Solutions Web site.
For more information on TPO124 OTN Mapper, click here
Thank you to those who joined us at Packet Transport Networks
IIR’s industry leading Packet Transport Networks conference took place in Milan, Italy, in the beginning of July this year, after being moved out due to the volcanic eruption in Europe in April.
TPACK joined other senior packet transport professionals to discuss how best to leverage advances in packet optical, NG-SDH, Connection Oriented Ethernet and MPLS to build a cost-effective and future proof transport platform. PTN is a specific and detailed forum designed to give attendees the opportunity to hear the most up to date thinking on packet evolution strategies, key technology advances, system developments, standards and deployment options - including case studies from both fixed and mobile service providers.
TPACK was a silver sponsor of the conference and led a righly relevent workshop on P-OTN Network Architecture Trends with very interesting guest speakers from Alcatel-Lucent, Ciena and ADVA Optical Networking.
If you were a delegate at the conference, you can download all the presentations from both the workshop and the two conference days here
- Click to enlarge
TPO series of OTN devices got expanded this spring
Earlier this year, TPACK had the pleasure to announce two new standard OTN devices, the TPOC244 and the TPOC314 ODU Multiplexers. The TPOC244/314 are the first standard IC products specifically made for large Terabit per second OTN Cross Connect systems with connectivity for hundreds of ODU0 of ODUflex channels as required by carriers such as Verizon and Deutche Telekom. By the use of the TPOC244/314 Telecom Equipment Vendors can reduce time to market for introduction of OTN Cross Connect line cards.
Since then, we have with great succes presented our customers with these two new products, and it has become clear to us that they are essential building blocks for the large ODU Cross Connects which are now emerging as a key platform type for next generation Optical Transport Networks. The TPOC244, the TPOC314 and our other cost-effective SOFTSILICON products have been incorporated into solutions that have won multiple design wins and the interest we are seeing is overwhelming.
For more information on our TPO series of OTN devices, please visit: http://www.tpack.com/products/p-ocket-otn-mappers.html
Article in EE-Times by TPACK
We would like to draw your attention to an article by TPACK called "SOFTSILICON - the next era of communications silicon" in EE-Times' Programmable Logic Design Line.
The article is written by TPACK's CTO Lars Pedersen and describes how the challenging dilemma in communications networks of delivering higher and higher bandwidth at lower and lower cost calls for a different model for silicon IC vendors. The solutions is a new model called SOFTSILICON which addresses the high bandwidth communications IC market in a sustainable manner.
See the full article here: www.pldesignline.com/225600016
