COPENHAGEN, Denmark – June 30, 2010 – TPACK (www.TPACK.com), an industry-leading provider of cutting-edge silicon ICs that provide core data transport and switching functions to leading telecom and networking equipment suppliers, today announced that Technology Marketing Corporation (TMC) has named the TPO124 OTN Mapper as a recipient of the 2009 Communications Solutions Product of the Year Award.
TPACK’s TPO124 OTN Mapper is designed to address the stringent performance and reliability requirements of next generation Optical Transport applications such as MSPPs, MetroWDM, P-OTN, and Carrier Ethernet Transport. The TPO124 OTN Mapper enables early market introduction of products that deliver new OTN mapping and networking features at a competitive cost. For instance, TPACK’s OTN Mappers are the only products in the market that support ODU0 and ODUflex mapping, protection and cross connection capabilities.
“We are honored to receive this award in recognition of a unique and groundbreaking product,” said John Jorgensen, VP Sales and Business Development TPACK. “We're very excited about this award as it truly validates the TPO124 as one of the most innovative solutions in data communications technology. The TPO124 and our other cost-effective SOFTSILICON products have been incorporated into solutions that have won multiple design wins and consistently displaced ASSP solutions at large Tier 1 providers. We intend to continue developing new leading edge products to meet our customers’ need for building OTN networking equipment that eliminates the need for SONET/SDH as an intermediate transport layer.”
“TPACK has been recognized with a 2009 Product of the Year Award for their admirable efforts in the advancement of data communications,” said Rich Tehrani, CEO TMC. “TPACK’s TPO124 has shown benefits for its customers and provides ROI for the companies that use it. Congratulations to the entire team at TPACK. I look forward to more innovative solutions from them in the coming year.”
The Communications Solutions Product of the Year Award recognizes the vision, leadership, and thoroughness that are characteristics of the prestigious award. The most innovative products and services brought to the market from March 2008 through March 2009 were chosen as winners of the Communications Solutions Product of the Year Award.
The 2009 Communications Solutions Product of the Year Award winners are published on the INTERNET TELEPHONY and Customer Interaction Solutions Web site.
For more information on the TPACK TPO124 OTN Mapper see: http://www.tpack.com/products/p-ocket-otn-mappers/tpo124.html
About TPACK
TPACK delivers cutting edge Silicon ICs providing core data transport and switching functions to leading Telecom and Networking equipment suppliers. TPACK’s SOFTSILICON products support the fastest deployment of new Carrier Class Packet and Optical Network standards, providing the most flexible, cost and power effective implementations throughout the life of the equipment. TPACK's customer base includes Tier 1 equipment providers who account for more than 50% of the optical transport equipment market.
TPACK is a privately held company headquartered in Copenhagen, Denmark with offices in Palo Alto, California.
For more information, visit www.tpack.com.
About TMC
Technology Marketing Corporation (TMC - www.tmcnet.com) is a global, integrated media company helping our clients build communities in print, in person and online. TMC publishes Customer Interaction Solutions, INTERNET TELEPHONY, Unified Communications, and NGN magazines. TMCnet, TMC's Web site, is the leading source of news and articles for the communications and technology industries. TMCnet is read by two million unique visitors each month on average worldwide, according to Webtrends. TMCnet has ranked within the top 3,500 in Quantcast's Top U.S. sites, placing TMCnet in the nation’s top .03% most visited Web sites. In addition, TMC produces ITEXPO; 4GWE Conference and M2M Evolution (in conjunction with Crossfire Media); Digium|Asterisk World (in conjunction with Digium); and Smart Grid Summit (in conjunction with Intelligent Communication Partners). TMC serves other communications market segments with the Cloud Communications Summit (in conjunction with Light and Electric); CVx ChannelVision Expo (in conjunction with Beka Publishing); and MSPWorld™ (in conjunction with the MSP Alliance).
For additional information, please contact:
Pernille Kennedy
Marketing Coordinator
Tel: +45 88 70 19 81
Email: pernille.kennedy@tpack.com
Ken Hagihara
Media Relations Representative
Tel: +1 949-768-4423 ext. 801
Email: ken@integritypr.net
TMC Contact:
Jan Pierret
Marketing Manager
203-852-6800, ext. 228
jpierret@tmcnet.com