Copenhagen, Denmark - April 17, 2009 – TPACK (www.tpack.com) announced today that its Board of Directors has named Colin L.M. Macnab as the new Chief Executive Officer of the company. Mr. Macnab brings more than 25 years of semiconductor industry experience with leadership roles in successful startups and large companies to lead TPACK in the next phase of the company’s growth.
TPACK has attained the position as a leading provider of Ethernet solutions for telecom transport technology, and as the telecom market now adopts the next generation of Optical Transport Networking (OTN), TPACK is well positioned to introduce its next generation OTN products to support this growing market. TPACK’s solutions offer; fastest time to market, most flexible development platform and cost effective implementation for a range of Optical Networking products and are in development now with leading telecoms equipment vendors world wide.
The board of directors in mutual agreement with the previous CEO Peter Viereck, decided that the company required a new CEO with a broad experience and strong network in the semiconductor industry and to appoint Colin to lead the next growth phase of TPACK. “Peter has done a great job in building a world class team that has delivered outstanding products and advanced the company to its current stage. With Colin’s depth of sales and marketing expertise and experience in growing successful businesses, I am convinced that TPACK will grow to become a market leader in its segment” said Hassan Parsa, Chairman of the board. “Colin will focus on growing TPACK and ensuring that we continue to provide the best support to our customers to integrate TPACK's innovative technology into the expanding market for Carrier Ethernet Equipment”.
Colin comes to TPACK from his most recent role as CEO of Artimi, an Ultra Wideband IC company. “I was most impressed with the technology and support that TPACK has delivered to many Tier 1 telecommunications equipment companies, and their enthusiastic approval of the results”, said Colin. “With the strong product portfolio and a new range of OTN products that TPACK will deliver this year, I am very pleased to join the company and lead the next stage of its growth to become a major technology provider to this industry”.
Prior to Artimi, Colin was vice president marketing and business development at Atheros, the leading Wifi IC company, where he was part of the team that took the company public in 2004. Prior to Atheros, Colin was founder and CEO of Morphics Technology, Inc., a fabless semiconductor company that developed the first wireless signal processor to support multiple standard cellular communications including most 3G standards. Morphics was acquired by Infineon in 2003. He was also founder and CEO of BMA Communications, serving a portfolio of clients that included National Semiconductor, IBM Microelectronics, Philips and Fujitsu. Earlier in his career Colin held marketing, engineering and management positions at Xircom, GEC Plessey, Linear Technology and Analog Devices. Colin holds a bachelor's degree in Electronic Engineering from the University of Glasgow, Scotland.
For more information, contact:
Thomas P. Rasmussen, VP PLM
Hoerkaer 12A, 2730 Herlev, Denmark
Tel: +45 8870 1983
Email: thomas.rasmussen@tpack.com
About TPACK
TPACK delivers leading edge solutions for providers of telecom transport products, and typically for the aggregation/metro access/metro core part of networks. The areas of expertise are transport of packets over SONET/SDH/PDH, OTN mapping and transport, and MPLS/Ethernet switching and traffic management. TPACK’s carrier grade solutions cover line rates from 1 Gbps to 100 Gbps with support of OAM and guaranteed service levels, protection and redundancy as opposed to enterprise grade solutions with focus solely on capacity. TPACK's customer base includes Tier 1 equipment providers who account for more than 50% of the optical transport equipment market. TPACK is headquartered in Copenhagen, Denmark with offices in Palo Alto, California.