Apr 27 2009
Category: General

TPACK Releases Two New White Papers

Packet-OTN The Transformation Continues

This white paper addresses the evolution of the “P-OTN” or Packet Optical Transport Network market. That is to say, packet transport networks built upon the ITU-T’s established set of OTN network standards such as Recommendation G.709. P-OTNs can be built using multiple optical, Ethernet and/or MPLS network elements, including fully converged elements which Verizon, for example, has termed “P-OTP” or Packet Optical Transport Platform.

Increasing packet traffic demands a further increase in Carrier Ethernet capacity and efficiency. A tighter integration of packets with the optical network is required, together with more intelligent and dynamic control and this is driving the development of P-OTN and the corresponding platforms with which to build them.

The next phase in P-OTN evolution is the development of MPLS-TP technology, which promises to reduce capacity costs and packet network complexity, while improving scalability and flexibility – and maintaining compatibility with the installed IP/MPLS router network. Carriers have never had more choice in technology integration options – and as the optimal solutions become evident, this dynamic market is set for further evolution.

To get your copy of the white paper, follow this link:
Packet-OTN The Transformation Continues

Enabling Ethernet-Over-NG-SONET/SDH Solutions for MSPP Linecards

The combination of Altera’s Arria II GX family and TPACK’s 2.5-Gbps/10-Gbps Ethernet-over-SONET/SDH and 10-Gbps/20-Gbps switch/NPU solutions meet the requirements of next-generation MSPP linecards and maintain existing infrastructure.

Traditionally, the development of application-specific chip products such as ASSPs is based on foundry manufacturing, either in-house or via commercial foundries. FPGAs also are based on this manufacturing process, but due to their broader and more generic application, the production volume that FPGAs attain justifies investment in the latest manufacturing processes and technology. In turn, this benefits the designer with lower power consumption and greater integration resulting in a lower cost per logic unit.

This white paper shows how TPACK uses Altera’s Arria® II GX FPGAs to offer new SOFTSILICON products for carrier-Ethernet-transport and packet-transport applications. Designed for cost-sensitive applications, Arria II GX FPGAs are the lowest power FPGAs with up to 3.75-Gbps transceivers. This allows TPACK to deliver solutions superior to traditional ASSP products in terms of power, cost, and features.

To get your copy of the white paper, follow this link:
Enabling Ethernet-Over-NG-SONET/SDH Solutions for MSPP Linecards

 

For additional information contact:
Pernille Kennedy
Marketing Coordinator, TPACK
Tel: +45 88701981
Email: pernille.kennedy@(if you can see this please update your browser)tpack.com